The world's first integrated lead-interconnect system
for implantable neurostimulator pulse generator devices.

Proven, packaged and pre-tested

The Encompass™ Lead-Interconnect System is the first pretested integrated lead-interconnect system designed for implantable neurostimulator pulse generator (IPG) devices. Enabled by Bal Seal Engineering’s proven SYGNUS® implantable contact system and rms Company’s premolded 16-channel header technology, Encompass is designed to help neurostimulation device companies save development time and costs. It provides OEMs with a means to integrate the header, connector, sealing components and lead into a single, ultra-reliable system.

Feature-rich and ready

Encompass is designed with a port-entry screw-anchor mechanism and can use one of three lead strain relief seal options, varying from a short transition strain relief seal to a longer strain relief seal for devices requiring a more gradual lead transition from the header port. A slot is molded into the header for the placement of a radiopaque identifier and a suture hole is included. The header is designed with a set of two anchors to firmly attach the header to the hermetic enclosure. The Encompass device header design incorporates all components required, including x-ray ID label for OEM device identification, mechanical anchor posts with pin retention, setscrew blocks, setscrews and setscrew seals. Additional hard polymer molded header options can accommodate leads with less than eight contacts and with external antennas.

Accommodating and advanced

Because Encompass is pretested and already incorporates both the header and the interconnect system including lead, it eliminates many of the roadblocks associated with design, development, sourcing and testing of a final product. In addition, the system reduces the package size needed for different therapy options for IPG developers.

A fit for your device

Encompass offers device designers a broad range of benefits:

  • Designed to neurostimulator system requirements
  • Compact - provides 2.01mm contact spacing/pitch
  • Adaptable for 4 and 6 contact leads
  • MICS antenna adaptable
  • Built on proven, ultra-reliable connector technology
  • Lower assembly costs
  • Lower assembly rework/scrap

The Encompass™ system eliminates the need to source and test separate header, connector, seal and lead components for neurostimulation IPGs.

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